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Why Global Semiconductor Firms are in Dilemma to Increase the Output of Wafer Fabs

The top-notch technology will provide a huge impetus to the R&D initiatives, but the major impediment is the lack of wafer fabrication at this level.

A recent survey report by Counterpoint Research highlighted that in 2022 the growth in revenue of international semiconductor wafer fabs augmented to 9 percent year-on-year, worth $120 billion. Experts added that this is staggering growth because for the past couple of years, there has been a massive imbalance in the logistics sector, massive shortages of components, currency undulation, and most importantly, macroeconomic slump. But, the situation proved to be very optimistic for the wafer fabs owing to the huge investments by the customers in the mature node devices across numerous segments such as 5G, AI, automotive, HPC, and IoT. Suppliers, which are at the top five, witnessed a huge profit of $95 billion in their services and systems.

While speaking of the revenue of the wafer fab equipment’s market, it is anticipated to reduce by 10 percent year-on-year to $108.45 billion after a continuous growth in the past three years. Although the market for WFE in 2023 does not look promising, the prospect of Extreme ultraviolet lithography (EUV) lithography looks quite promising due to continued deployment of EUV into logic and memory. Not only that, foundries all over the world are increasing manufacturing chips of 3-nm nodes by utilizing FinFET architectures and Gate-All-Around transistors along with escalated adoption of EUV technology.

Dale Gai who is the associate director at Counterpoint Research opined that over the last couple of months, TSMC has started working on innovative capacities in in 7/6nm and 5/4nm owing to the decreased demand in the market, but the capital and the investment on 3-nm process nodes remains almost same like it was planned in the first half 2023. The point to be noted is that during the time of COVID-19 pandemic, various segments of the semiconductor industry have witnessed soaring prices because of the huge disruption in the supply chain. On the other hand, the electric vehicle technology is gaining a huge momentum and therefore, the entire automobile industry has seen a surging growth.

Nonetheless, the unexpected increasing demand of semiconductors during the time of pandemic has caused prices to augment in the data center and industrial market. The slow growth has also happened due to the inflation, which has reduced the orders for consumer electronic goods, and mobile phones. The expansion of AI, start-ups, and other technologies are happening on a rapid scale, the requirement of microchips are also increasing throughout the world.

semiconductor manufacturing

Recession is another major obstacle currently among various industries, which has forced semiconductor companies to take into consideration whether they should increase the output of wafer fabs or not. The current skills in manufacturing and end-to-end design are magnetizing the interests of various businesses across the globe. The top-notch technology will give a huge impetus to the R&D initiatives, but the major impediment is the lack of wafer fabrication at this level. Building a wafer fab requires huge investment and is very expensive and also needs gallons of water which is why there are not many fabs available currently. Here, government incentives and subsidies will play an imperative role and the Chinese government has already assured to invest around USD 73 billion as semiconductor subsidies, while Japan, US, and Europe failed to equate that amount.

In the past three quarters, no major investment unifications have been done and therefore every country is investing on their own without proper analysis and knowledge. As consumers now require more top-notch devices, the production must be increased to a larger extent, feel experts. There are about 150 300-mm fabs located, with 12 in Europe and Middle East, 33 in China, 42 in Taiwan, and 19 in the US. This is why the volume of supply as per the demand is still unnatural. The massive level of production and activity still happens at the 200-mm fab with demand being the same for various nodes starting from 90nm to 180nm processes. The total number of 200mm fabs all over the world is 230 with 49 in the Middle East and Europe and 51 in the US.

The question here appears to be why the WFE market increases every year. As per a previous report of CircuitDigest, various characteristics such as the escalating demand from the consumer and B2B electronics industry coupled with ever-increasing technological improvements in the semiconductor and telecom industry are speculated to spearhead the demand for the semiconductor wafer fab equipment market from 2019-2030. There are some additional factors like equipment and silicon wafer that would assist in analyzing the concerned market in the coming years. Most importantly, new-fangled innovation in wafer technology has crafted a denser packaging of devices like transistors and MEMS (micro-electro-mechanical system) are speculated to create a way for the foundation of innovative opportunities that can be leveraged by various global firms.

Now, speaking of the current wafer fab market globally, in 2021 the market was worth USD 62930 million and by 2030, the market is expected to reach at USD 97470 million at a CAGR of 5.6 percent between 2022-30, according to a report of capital market firm MarketWatch. But, another research firm Verified Market Research added that in 2021, the WFE market reached at USD 68,989.03 million and by 2030, it is expected to grow USD 164,669.67 Million at a CAGR of 8.04 percent between 2023-30. The technological developments over the past few years have spearheaded the growth of this sector. The growth in memory storage capacities and the augmenting compactness of numerous communication products in the telecom industry are responsible behind this growth.

global wafer equipment market graph

Going by the detailed analysis, the WFE market is divided into Latin America, Europe, North America, and Asia Pacific. In 2021, the biggest market share in this segment was grabbed by the Asia Pacific region and is expected to increase at a CAGR of 8.53 percent in the forecasted period. The region is leading because of the fact that there are solid supply chains of semiconductor devices such as discrete devices, circuits, and logic circuits across nations like China, Taiwan, and Japan. As there is a huge growth in consumer electronics and automotive products, the demand for IC chips and SIC wafers are also expected to increase.

Other than that, there are huge volumes of suppliers in South Korea and in India, who are contributing to the huge growth of this market. In the same year, North America stood as the second biggest region and during that time it was predicted that this region is likely to contribute massive growth. But huge subsidies, and incentives offered by the government of the Asia Pacific region has helped them to lead the market. Increasing demand along with rising income, growth of advanced machinery and technology, and programs for spreading the importance of the requirement will help the WFE market to grow immensely over the years.

Counterpoint’s Senior Research Analyst Ashwath Rao said, “Considering the growth in terms of US dollar, the overall volume of WFE market slumped by around 8 percent in 2022 as it was negatively impacted by currency fluctuations, and especially reduction in value of euro and yen denominated sales ever since the starting of 2022. Ahead of the inflection in 2022, there is an escalation in R&D investment that has put the WFE market to outperform the semiconductor market for a long term.”

Highlighting the overall scenario of the market in 2023, Rao mentioned in a survey report, “Manufacturers are more skewed towards foundry-logic segments today unlike in 2019, and with overall backlog strength, increased visibility in terms of long-term agreements and subscription model will help limit the downside. The weakness in wafer fab equipment spending in 2023 will drive lead time and inventory normalization. The slowdown in memory-oriented investments will begin to recover gradually starting in the second half of 2023, and 2024 will be a big year for the equipment industry. Manufacturers are well positioned to take advantage of the opportunity."

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How to Build an XOR Gate with Transistors?

Submitted by Gourav Tak on

In the vast world of digital electronics and logic circuits, The XOR gate stands as a fundamental building block that plays a crucial role in information processing. XOR, short for Exclusive OR. Is a logical operation that produces an output of high when the number of high inputs is odd, and low when the number of low inputs are even. This unique characteristic makes the XOR gate an essential component in various applications, ranging from simple binary arithmetic to complex data encryption algorithms.

In this article, we will explore the inner working of the XOR gate, including its truth table, logical symbol representation, circuit diagram, and practical  construction using transistors.

Previously, we have built many electronic circuits to perform logic gates like XOR Gate, NAND Gate, NOT Gate, NOR Gate, AND Gate, OR Gate, XNOR Gate. 

What is an XOR Logic Gate?

The XOR gate is also called the exclusive OR gate. An electronic XOR gate performs the digital logic XOR function. This function is generally similar to the standard OR function with one critical difference. For both OR and XOR, the output is high when either of the two inputs are high, and when both inputs are low, the output is low.

However, when both inputs are set to a high state, the standard OR circuit will produce a high output signal, whereas the XOR circuit will generate a low output signal. This fundamental behavior is the reason behind it is called exclusive OR gate. In the simplest design of XOR gate only 5 transistors are needed.

XOR Gate Symbol

XOR Gate Symbol

Truth table of XOR gate

Inputs

Output

A

B

Y

0

0

0

0

1

1

1

0

1

1

1

0

 

Boolean expression for this gate is

Y = (A ⊕ B)

Output

(A ⊕ B) = A.B + A.B

The truth table above shows clearly demonstrates that the output of an Exclusive-OR gate will only goes “HIGH” when both of its two input terminals are at different logic levels with respect to each other. If these two inputs, A and B are both at logic level “1” or both at logic level “0” the output is a “0”.

Logic Diagram of XOR Gate

Logic diagram of XOR gate

As can be seen in the logic diagram above, the Ex-OR gate is built by combining three different types logic gates, the OR gate, the NAND gate and the AND gate to produce the desired result.

Components Needed for building XOR gate

So with just the few components, we can construct a XOR gate circuit.

  • 2N2222 (NPN) transistors x5
  • 10kΩ resistors x3
  • 220Ω resistors x3
  • Push buttons x2
  • Breadboard x1
  • 9V Battery x1
  • LEDs and Connecting wires

Circuit Diagram of XOR Gate using Transistors

The circuit diagram below illustrates the XOR gate using 5 NPN transistors. Here, I1 and I2 represent the two inputs, and O1 signifies the output.

Circuit Diagram of XOR Gate using Transistors

The picture shows a simple XOR gate circuit that uses 5 transistors. In the layout inputs A and B are both connected to 9V supply. Different color connecting wires help to see the connections. If there is any ambiguity in the placement of wires the circuit diagram can be referenced.

The gate design is a NAND gate on the left two transistors, a switch for the middle transistors, and an OR gate for the last two transistors.

Circuit of XOR Gate with Transistors

Upon examining the configuration shown in the photo, it becomes evident that the current generated by the far-right resistor is unable to reach the ground on the lest, resulting in the LED remaining off. The reason behind this lies in the fact that all the current generated by the first resistor on the left is directed towards the first ground. Consequently, the switch remains in the off position due to insufficient voltage entering the base of the third transistor.

In the event that one input is activated, the current gains ability to flow from the far-right transistor to the second ground. Finally, when both inputs are deactivated, the output remains off since the current fails to enter the base of the OR gate transistors. this configuration prevents the current from traveling from the far-right resistor to the second ground.

Applications

From the depth of cryptography to the realm of error detection, the XOR gate proves to be an indispensable ally. It possesses the power to perform bitwise operation, enabling binary addition and subtraction, ensuring data integrity, and even generating parity checks. This gate’s versatility and elegance have solidified its role in countless digital system, paving the way for technological advancements that shape our modern world.

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A Simple DIY Bluetooth Audio Player using Wireless Hi-Fi Amplifier Module

The Bluetooth Amplifier Module is useful for DIY projects for creative and hobbyists. The module’s Bluetooth connectivity makes the project connect wirelessly and gives hustle-free entertainment. The board can work on Lithium-ion/Li-Po or Lead Acid battery, which is used to make the device portable. Its design makes it easy to implement the module for projects that are handy, cheap, and provide High Sound Quality.

You can build your own DIY Bluetooth Music Player using Audio Amplifier to use at home/office, or while traveling.

In this project, we will learn the connections and circuitry of the Module. Also, gather some necessary information and Technical Specifications.

Circuit Digest have built many audio circuits, check out the huge collection of audio circuits with schematics and detailed explanation, to help you build Audio projects and use them for your Audio designs. Also check previously built DIY music player:

Wireless Hi-Fi Bluetooth Amplifier Module

Wireless HI-FI module is a Class AB / Class D switching function, 5.3W output power single channel audio power amplifier Board with Built-in Bluetooth, FM, USB, aux cable, and memory chip decoder support.

Wireless Hi-Fi Bluetooth Amplifier Module

With its comprehensive set of input ports and impressive features such as compactness, attractive design, and high audio quality, this module stands out from other boards. Its versatility makes it a preferred choice for various applications.

  • A power switch to turn ON/Off the module.
  • A micro-USB charging connector at fixed 5-volt input.
  • AUX-Cable 2.5 mm female Input Jack.
  • USB card, TF card Input ports.
  • Inbuilt Bluetooth & FM Support.
  • A Multi-Purpose Functioning Switch.
  • It has two inbuilt Red & Green LED indicators [see their functionality later].

The module has a lot more internal options for supporting other features. The module also has two Open connections to connect MIC and an extra LED for power indication, as indicated in the below diagram.

Bluetooth Amplifier Module Parts Name

  • Connecting an extra LED to the Board will not be effective as it only indicates the ON/OFF status according to the power switch.
  • Soldering a small piece of wire to the FM Antenna Terminal will make the signals and audio quality better while in FM Mode.
  • Connecting MIC is very helpful & Futuristic for your project. It allows you to talk on calls during the module connected to the smartphone via Bluetooth or AUX.

Bluetooth Amplifier Module Speaker and Battery Connector

Bluetooth Audio Amplifier Circuit Diagram

DIY Bluetooth Music Player Circuit Diagram

Let’s have a look at the comprehensive circuit connections of the Board which are very straightforward & simplest design to understand.

Connect the Battery to the battery connector of the module. You can use a 3.7-volt lithium-ion Battery or a 4-volt Lead Acid Battery.

Battery Input-voltage Range: Using this Module, we can able to see the battery draining percentage in our Smartphone. This function purely works based on the Remaining battery voltage which is sensed by the controller IC.

  • At 3 volts, it shows the battery fully drained [0%] while at 4.2-volts it sensed the battery as fully charged [100%].
  • We can give up to 5 volts to the battery terminals of the module to boost the audio quality performance of the audio IC.

Note: This module can also work with the direct power of a Micro-USB charging Connector whose input is fixed at 5 volts without any battery.

Speaker Matching Specifications

The Module uses a HAA2018 audio IC whose Vdd range is 2.5-5.5 volts. It is a Class AB / Class D switching function, 5.3W output power single channel audio power amplifier IC whose Technical Specification are:

Class D output power:                  

  • 5.3W (VDD=5.0V, RL =2Ω，THD+N=10%)
  • 3.2W (VDD=5.0V, RL =4Ω，THD+N=10%)

Class AB output power:               

  • 5.2W (VDD=5.0V, RL =2Ω，THD+N=10%)
  • 3.1W (VDD=5.0V, RL =4Ω，THD+N=10%)

The RL denotes the Load Impedance whereas the VDD is the battery terminal voltage to the audio IC.

Others Features:

  • Low distortion and low noise
  • Start-up POP sound suppression function
  • Shutdown current is less than 1uA
  • Overheat protection function

Since, from the above technical specification, you can be aware that at 2Ω Load impedance, the output power will be highest. If you can find 2Ω 5w Speaker, then it will be well & good otherwise you have to set a Series/parallel combination of speakers to match the impedance and power rating according to the output rating of the Amplifier module. In general, it is advisable to match both the impedance and power ratings when connecting speakers and amplifiers. If possible, it is recommended to use a speaker with an impedance that matches the amplifier's output impedance. Additionally, selecting a speaker with a power rating equal to or higher than the amplifier's output power will provide better performance and reduce the risk of damaging the components.

Since our Amplifier output rating is 2Ω 5w, hence I am using two 4Ω 2.5w speakers in parallel connection which is equivalent to the Amplifier output.

Amplifier and Speaker Connection Diagram

Let’s have a look at the real circuit prototype in the below image

Bluetooth audio amplifier Circuit

Demonstration of Bluetooth Audio Amplifier Board

We have already seen the connection details above, and now we get an insight into the functioning of such a kind of Board like how its indicators work differently in different modes.  

  • Connect the lithium-ion battery properly by taking care of +ve & -ve correct terminals. Also, connect the speakers with the correct matching for proper audio quality.
  • Turn-On the switch and check for a Blue blinking LED.

Mode and LED Indicator

The Module works in different Five types of Modes, these are Bluetooth, FM, AUX, Pendrive, and SD-card Mode. The Blue LED indicator indicates a bit differently in each mode, making it easy to understand the internal functioning of the board.

Bluetooth Mode: The module is always in BT mode by default after turning ON the Board.

  • The Blue Led blinks fastly until the BT will not be paired.
  • Led Continuous ON after pairing or while pausing the song.
  • Blinks Slowly while playing the Song.

FM Mode: Holding & pressing the multi-function button towards the center will change the mode to FM.

  • The Blue Led blinks fastly until all the channels will not be scanned.
  • Blinks Slowly while playing a channel.

USB/SD-card Mode: The module will automatically initiate the USB-drive mode when you plugged in a USB-Drive.

  • Led Continuous ON while pausing the song or if there is no song inside the memory drive.
  • Blinks Slowly while playing the Song.

Note: Mp3 songs must be present in the Flash drive otherwise it won’t Access the USB drive.

AUX Mode: Connect an AUX cable to provide audio input to the board from Smartphone.

  • Always Blinks Slowly while playing/pausing the Song.

Charging Functionality

It has a Micro-USB input port to charge the Battery pack attached to the Module. There is a Red Led to indicate the charging mode of the module. The Red Led is continuously glowing while battery charging.

Charging voltage at battery terminal: 4 volts

Charging current: ∼200 mA

Note: Don’t charge the device while using it because it will not charge your battery.

Bluetooth audio amplifier Circuit

Hope you enjoyed the project and learned something useful from it. If you have any questions, you can leave them in the comment section below.

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Raspberry Pi Pico W Bluetooth: C/C++ and MicroPython Update

The Raspberry Pi Pico W is a versatile microcontroller board that packs a lot of power into its compact form factor. With the integration of Wi-Fi and Bluetooth capabilities, it opens up a world of possibilities for projects that require wireless communication.

Bluetooth C/C++ SDK Support

To make use of Bluetooth on the Pico W, the latest version of the Pico SDK (1.5.0) introduced Bluetooth functionality that was previously unavailable. This update brings various Bluetooth libraries that expand the capabilities of the Pico W when it comes to utilizing Bluetooth technology.

Here's an overview of the available Bluetooth libraries for the Raspberry Pi Pico W:

Bluetooth Classic: This library enables communication using traditional Bluetooth technology. It allows you to connect and communicate with other devices that support Bluetooth Classic, such as smartphones, computers, and other microcontrollers.

Bluetooth Low Energy (BLE): BLE is a power-efficient variant of Bluetooth designed for low-power devices. It enables you to create energy-efficient applications that can communicate with other BLE-enabled devices, such as fitness trackers, smartwatches, and IoT devices.

Bluetooth Sub Band Coding (SBC) encoding/decoding: This library provides audio encoding and decoding capabilities using the SBC codec. With this feature, you can stream audio wirelessly between the Pico W and other Bluetooth-enabled devices, such as speakers or headphones.

Bluetooth Network Encapsulation Protocol (BNEP) support using LwIP: BNEP support allows you to encapsulate network traffic over Bluetooth connections using the Lightweight IP (LwIP) stack. This feature enables you to establish network connections and exchange data between the Pico W and other Bluetooth devices.

Bluetooth Network Encapsulation Protocol (BNEP) support using LwIP with FreeRTOS for NO_SYS=0: This library offers BNEP support specifically for systems using the FreeRTOS operating system with the NO_SYS=0 configuration. It allows you to use BNEP over Bluetooth connections while leveraging the benefits of FreeRTOS.

These Bluetooth capabilities on the Raspberry Pi Pico W open up exciting possibilities for various projects. For example, you can create applications that involve audio streaming, where the Pico W acts as a Bluetooth audio source or receiver. You can also implement volume control functionality to adjust audio levels wirelessly. Additionally, you can explore projects that turn the Pico W into a Bluetooth keyboard or mouse, allowing it to interact with other devices.

To get started with Bluetooth on the Raspberry Pi Pico W, you'll need to follow the Pico SDK's quick-start instructions. These instructions provide guidance on setting up the necessary software tools and libraries to utilize Bluetooth features on the Pico W. Additionally, the Pico SDK documentation includes numerous Bluetooth examples that can serve as a reference for your own projects.

Note: - The Bluetooth support for pico W on Arduino IDE has yet not been confirmed or arrived.

Micropython Support

While MicroPython support for Bluetooth on the Pico W has not been officially released yet, there are indications that work is underway. Jim Mussared, the founder of MicroPython, has acknowledged the demand for Bluetooth support and mentioned active development efforts. This suggests that MicroPython support for Bluetooth on the Pico W may become available in the near future. To stay updated on the progress, you can monitor the relevant GitHub thread where the development is being discussed.

Once MicroPython support for Bluetooth is added to the Pico W, it will further enhance the accessibility of Bluetooth capabilities for a wider range of developers and enthusiasts. This will unlock even more exciting possibilities for creative projects, as it will enable developers to leverage the simplicity and ease of use offered by MicroPython while utilizing Bluetooth features on the Pico W.

In conclusion, the Raspberry Pi Pico W's integration of Wi-Fi and Bluetooth capabilities brings immense potential for wireless communication and opens up new avenues for innovative projects.

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How US WIll Lead The Global Wireless Market Amid Tough Challenges

US government must provide a crystal-clear strategy when spectrums will be available so that businesses, operators, component and hardware providers can prepare themselves before utilizing these spectrum.

The industry association Cellular Telecommunications and Internet Association (CTIA) hosted the 5G summit on May 17, 2023, in Washington DC where numerous bigwigs from the US government and the wireless industry assembled to discuss the monumental improvement in unleashing the 5G networks and the new use-cases. At the event, the officials also discussed the pending works that need to be done and the grave impediments, which the industry is facing. Devoid of any skepticism, there is a sense of positive vibes about the new opportunities that 5G promises to bring, but many believe that it is still in the early stages. The industry leaders have opined that for a successful 5G penetration, policymakers must look forward for more incentives, schemes, and also support it.

During the event, a plan has been chalked out by the speakers about how much improvement has been made on 5G and by all measures, it has been made clear that it is the fastest deployed wireless generation yet. Now, if we speak about the mmWave frequencies, low-band, and mid-band, AT&T, Verzon, and T-Mobile cover 320 million US citizens. The unleashing of mid-bands have been very fast, while AT&T’s senior vice president of Engineering and Operation, Egal Ilbaz highlighted that the company will be able to reach 200 million Point of Presence (PoPs) towards the end of 2023, while on the other hand, Neville Ray, President of Technology, T-Mobile stated that their firm would be able to reach 300 million PoPs.

Why The Federal Communications Commission Allowing Additional Spectrum for 5G Services?

A year back, the FCC has made high-band spectrum auctioning a top priority. The first 5G spectrum auctions have been done in the  28 GHz band; the 24 GHz band; and the upper 37 GHz, 39 GHz, and 47 GHz bands. The Commission along with these auctions is also allowing 5 gigahertz of 5G spectrum into the market and is also undertaking efforts to free up 2.75 gigahertz of 5G spectrum in the 26 and 42 GHz bands. Additionally, the FCC has taken a step for more useful utilization of additional millimeter-band spectrum in the 70/80/90 GHz bands. According to a report of FCC's official website, Mid-band spectrum has become a target for 5G buildout given its balanced coverage and capacity characteristics. With their work on the 2.5 GHz, 3.5 GHz, and 3.7-4.2 GHz bands, they will make more than 600 megahertz available for 5G deployments. And speaking of the low-band, the FCC is acting to improve use of low-band spectrum (useful for wider coverage) for 5G services, with targeted changes to the 600 MHz, 800 MHz, and 900 MHz bands.

Speaking of the 5G infrastructure policy in the US, they must be updated by the FCC so that more investments can be made in the 5G ecosystem. Chairwoman of the FCC, Jessica Rosenworcel told the global media, "If we want broad economic growth and widespread mobile opportunity, we need to avoid unnecessary delays in the state and local approval process. That’s because they can slow deployment.” In an effort to promote digital opportunity for every US citizen, the outmoded regulations will be modernized by the FCC. The 5G fund for rural US has been established by the FCC in October 2020 so that they can have around $9 billion in Universal Service Fund by which the operators will be able to set-up cutting-edge 5G mobile wireless services in the rural USA, which also includes $680 million for deployment on the tribal lands.

Back in 2022, the FCC had commenced bidding auction of mid-band spectrum and that bidding auctioned around 8,000 county-based licenses in the 2.5 GHz spectrum band in mostly the rural region of America. According to an exclusive report of Reuters, AT&T Inc led bidders in the 3.45 GHz mid-band spectrum auction, winning $9.1 billion, while T-Mobile won $2.9 billion and Dish won $7.3 billion. FCC C-Band spectrum auction last year, three of the biggest US wireless firms won $78 billion in bids. For 3,511 licenses, Verizon Communications paid $52 billion, while T-Mobile grabbed $9.3 billion, and AT&T grabbed $23.4 billion in licenses.

The Ongoing Challenges Of The Wireless Industry And What’s Next For 5G

5G technology has already transformed the consumer’s lives in various ways, but according to the experts, bigger organizations will benefit more from this technology as it has the potential to power connected irrigations, smart cities, factories, and many more. Now, the executives from DISH, Verizon, T-Mobile, and AT&T were all highlighting the flexibility and the opportunities that virtualized, software-powered networks would provide benefits for developers in the organization. The low-latency AI and ML applications will be deployed seamlessly for efficiency by distributed computing at the edge. The situation is also a bit pessimistic because in the enterprise level, the 5G development is slow and the foggy economic ecosystem would prevent some organizations from experimenting and deploying 5G to perk-up their productivity.

But, as the unleashing of mid-bands is happening soon, 5G will be able to benefit the enterprise to improve their outputs. During the 5G summit, the speakers have made it clear that Chinese operators are going to fulfill 25,000 orders for the private networks. Although the US is a bit behind in this scenario, which will obviously change in the coming few years. The problem of digital divide can be countered by the wireless industry. The arrival of fixed wireless access (FWA) offers a replacement for the fiber, which will be low-cost in various parts of the world while offering the required capacity and speeds to connect rural areas, thereby improving trade, education and various other sectors.

Even though 5G is furnished with numerous opportunities, there are some strict hurdles that are preventing this technology from reaching its potential. Experts claim that the ongoing high level of geopolitical tensions between China and the US is an imperative factor. Also, the executives from Ericsson and Samsung have stated that the state subsidies provided by the Chinese government for its infrastructure firms makes it very intricate to compete on the price, which forces numerous nations to go for Chinese wireless network providers.

Matthew Orf, the US based research analyst at Counterpoint Research said, "The Government of China’s Aggressive business strategy for unleashing 5G has given the country a chance to spearhead the wireless industry and chinese network providers and organizations are having a huge experience in deploying new use cases before the western nations. This is ultimately offering the Chinese firms a tremendous competitive advantage in regards to their western rivals.”

“Now, if we look towards 6G, the geopolitical tussles between China and the US is going to negatively impact the entire global wireless market, which would also decrease the interoperability and scale. Therefore, America must work closely with its allies throughout the world to have a single standard out of which everyone can benefit,” added Orf.

Orf also highlighted that in an effort to counter these hurdles, the industry leaders called the US policymakers to give more authorization to the FCC to open spectrum auctions and provide more spectrums for the operators. This is because the volume of data consumption is augmenting very rapidly, while more spectrum is also required for the new enterprise use-cases. But, this authorization to the FCC is not enough and the US government must provide a crystal-clear strategy when spectrums will be available so that businesses, operators, component and hardware providers can prepare themselves before utilizing these spectrums.

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How to make a Gyroscope?

Have you ever wanted to try building your own gyroscope? Well, you're in luck! In this blog post, we'll guide you through the steps to make a gyroscope using just a few simple materials.

How does a Gyroscope work?

A gyroscope is a sensor that measures and maintains orientation and angular velocity. It is commonly used in various applications such as navigation systems, robotics, aerospace, and virtual reality devices.

The math behind a gyroscope has to do with how it stays upright. When you spin the small CD attached to the motor, it starts to spin really fast. This creates something called "angular momentum," which is like a special kind of energy that makes things spin around.

Gyroscope Circuit on CD

The bigger CD is attached to the small CD and motor, so it also starts to spin around. This makes the whole gyroscope spin around as well. But even if you move the gyroscope around, it stays upright because of something called "torque."

Torque is a special kind of force that makes things rotate. When you move the gyroscope around, it experiences torque that causes it to rotate around a different axis. The rate of precession is proportional to the amount of torque applied and the angular momentum of the gyroscope.

The equation for torque is

T = I * α,

Where T = torque applied,

I = moment of inertia (a measure of how difficult it is to rotate an object), and

α = angular acceleration.

So in simpler terms, the faster the small CD spins and the bigger the CDs are, the harder it is to move the gyroscope around because it has a lot of angular momentum.

I hope that helps make it easier to understand!

What you’ll need:

  • 1 small DC motor
  • 1 big CD
  • 1 counterweight
  • 1 9V battery
  • 1 switch
  • Hot glue or double-sided tape
  • Small bolt (optional)

Attach CD to Motor

Attach CD to Motor

First, take the CD and attach it to the DC motor in the way which is shown in the image above. You can do this using some hot glue or double-sided tape. Make sure the CD is centered on the motor's shaft so that it will spin smoothly.

Attach Counter weight to Motor Shaft

Attach Counter weight to Motor Shaft

Next, take the counterweight and attach it to the shaft of the motor. You can use a small bolt or some more hot glue to secure the motor shaft to the counter weight. I have used a wheel as a counterweight but it’s not necessary. You can use anything which has a symmetrical shape as the counterweight, but you need to do some trial and error.

Circuit Diagram

Gyroscope Circuit Diagram

Now it's time to wire everything up! First, connect the switch to the 9V battery. Then, connect the positive wire from the battery to the positive terminal on the motor. Connect the negative wire from the battery to the negative terminal on the motor.

Test Your Gyroscope

Once everything is wired up, you can test out your gyroscope by turning on the switch. The motor should start spinning the smaller CD, and the larger CD should rotate around it. You've just created your very own gyroscope!

Experiment!

One of the coolest things about gyroscopes is their ability to maintain their orientation and rotation even when they're disturbed. You can experiment with your gyroscope by tilting it to one side and watching it slowly right itself. Try using different sizes and shapes of CDs to see how they affect the gyroscope's behavior.

Building your own homemade CD gyroscope is a fun and educational project that you can do in just a few hours. Try to make this project and tell us what you learned!

Projects using DC Motor

Control DC Motor with Arduino and L293D Motor Driver IC
Control DC Motor with Arduino and L293D Motor Driver IC

Explore the exciting world of robotics and learn how to control DC motors with Arduino and the versatile L293D Motor Driver IC. In this blog post, we'll guide you through the step-by-step process of setting up the motor driver, connecting it to your Arduino board, and programming it to control the speed and direction of your DC motors. Unleash your creativity and bring your robotic projects to life with this essential knowledge!

Low Power SMS Based Vehicle Tracking System with A9G GSM+GPS Module and Arduino
Simple H-Bridge Motor Driver Circuit using MOSFET

Take a deep dive into motor control as we unveil the secrets of constructing an efficient H-Bridge motor driver circuit using MOSFETs. Our comprehensive blog post will guide you through the circuit building process, shed light on the underlying principles of H-Bridge operation, and empower you to effortlessly control the direction and speed of your DC motors. Expand your technical expertise and unleash the true potential of motor control in your projects with this invaluable knowledge.

Interfacing DC Motor with AVR Microcontroller Atmega16
Interfacing DC Motor with AVR Microcontroller Atmega16

Are you ready to take your motor control skills to new heights? Join us as we delve into the exciting world of interfacing DC motors with the powerful AVR Microcontroller Atmega16. In our insightful blog post, we'll guide you through the entire process, from establishing a seamless connection to programming the Atmega16 for precise control over the speed and direction of your DC motors. Discover how this integration opens up endless possibilities for your projects, allowing you to unleash the true potential of motor control. Get ready to elevate your technical prowess and create remarkable innovations with AVR Microcontroller Atmega16 and DC motors.

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Finarb Aims To Work Towards Creating More Awareness About The Benefits of AI in Manufacturing

As the decision makers and international industries are facing numerous hurdles, there is a need of the hour to transform manufacturing with the assistance of the most sophisticated technologies. The industries need to revamp and restructure their industrial assets (software or hardware) and obviously control systems.

Simple DIY Wireless Bluetooth Speakers using Audio Amplifier

For those who love tinkering with electronics, making a Bluetooth speaker from scratch can be a satisfying and a fun experience. In this article, we'll learn step-by-step guide on how to build your very own wireless Bluetooth speaker using basic electronic components under 9$ or 700rs. We have previously built many audio related projects using various amplifiers, follow the link to learn more.

Materials you’ll need:

  1. Bluetooth audio receiver
  2. Amplifier
  3. Lipo battery
  4. Switch
  5. TP0456
  6. Acrylic laser-cut parts
  7. Some wires
  8. A soldering iron
  9. A hot glue gun

Before we dive into the step by step process. Let’s understand working of some of the important modules which are necessary to build this speaker

Bluetooth Audio Receiver 3.0 Module

The Bluetooth audio receiver module can receiver audio signal wirelessly from source and then can send output directly (for low watt speakers) or to the amplifier (for high watt speakers).

The input is received through Bluetooth and then these signals are sent to LOUT and ROUT pins as output. This module needs to be powered through a 5V DC power supply.

Pinout of Bluetooth 3.0 Audio Receiver Module

Pinout of Bluetooth 3.0 audio receiver module

LOUT Left audio output. This pin provides the left audio channel output from the module.

ROUT Right audio output. This pin provides the right audio channel output from the module.

DC5V 5V Power supply input pin for the module

GND Ground pin for the module.

PAM8403 Amplifier Module

The PAM8403 is an audio amplifier module. Amplifier is a device which is used to convert weak signals into strong signals i.e increase the magnitude of the signal.

In our use case, the amplifier module is used so the input received from the Bluetooth module can be amplified and thus sent to the speakers through left and right channel output.

Pinout of PAM8403 Amplifier Module

Pinout of PAM8403 Amplifier Module

VCC Power supply pin for the amplifier module. Connected to the positive terminal of the power source (5V) or voltage regulator.

GND Ground pin for the amplifier module. Connected to the negative terminal of the power source and ground reference.

LIN Left channel input. This pin receives the audio signal for the left audio channel.

RIN Right channel input. This pin receives the audio signal for the right audio channel.

GND Ground pin for the audio input signals. Connected to the ground reference of the audio source.

LOUT+ Positive left channel output. This pin provides the amplified positive signal for the left audio channel.

LOUT- Negative left channel output. This pin provides the amplified negative signal for the left audio channel.

ROUT+ Positive right channel output. This pin provides the amplified positive signal for the right audio channel.

ROUT- Negative right channel output. This pin provides the amplified negative signal for the right audio channel.

Circuit Diagram of PAM8403 Module

Circuit Diagram of PAM8403 Module

The PAM8403 is an audio amplifier module that can amplify sound signals to drive speakers. It is a 2-channel amplifier, which means it can handle both left and right audio signals. The module has a power supply pin (VCC) and a ground pin (GND) to provide the necessary power for the amplifier to work.

To connect audio signals, there are two pins called INL and INR, which stand for left and right channel input. These pins receive the audio signals from your audio source, like a smartphone or computer. To improve the audio quality, it is recommended to connect a small capacitor (0.47µf) between these input pins and the ground. This helps reduce any unwanted noise that may come from the power supply.

The amplified audio signals are then sent to the speakers. The module has four output pins: ± OUT_L and ± OUT_R. The positive side of the left channel connects to the + OUT_L pin, and the negative side connects to the - OUT_L pin. Similarly, the positive side of the right channel connects to the + OUT_R pin, and the negative side connects to the - OUT_R pin.

One of the advantages of the PAM8403 is that it doesn't require additional low-pass output filters. This means it can directly drive the speakers without the need for extra components, making it more efficient compared to other amplifier types. The recommended operating voltage for the PAM8403 is 5.5V, so you should provide a power supply that matches this voltage to ensure proper operation.

Commonly asked questions about amplifier modules

What is the use of PAM8403 amplifier module?

The PAM8403 amplifier module is commonly used to amplify audio signals and drive speakers in various applications. It is particularly popular in portable audio devices, such as Bluetooth speakers, MP3 players, and small audio systems. Its compact size, efficiency, and filterless architecture make it suitable for low-power audio amplification needs.

Difference between class:- A, B, AB and C amplifiers

Different amplifier classes refer to the way the amplifiers operate and their efficiency. Class A amplifiers have high-quality output but lower efficiency as they continuously consume power. Class B amplifiers use two transistors to amplify positive and negative halves of the input signal, resulting in better efficiency but with some distortion at the crossover point. Class AB amplifiers combine characteristics of Class A and B amplifiers, aiming for both decent quality and improved efficiency. Class C amplifiers are highly efficient but not suitable for audio due to their high distortion, mainly used in radio frequency (RF) applications.

What are the different types of amplifiers according to their use case?

There are several types of amplifiers based on their use case, including:

Audio Amplifiers: Used to amplify audio signals for speakers or headphones, ranging from small audio devices to home theater systems.

Instrument Amplifiers: Specifically designed to amplify electric musical instruments like guitars, keyboards, and basses.

RF Amplifiers: Used in wireless communication systems and RF devices to amplify radio frequency signals.

Operational Amplifiers (Op-Amps): Widely used in electronic circuits for various applications, such as amplification, signal conditioning, filtering, and mathematical operations.

Power Amplifiers: Designed to amplify high-power signals, typically used in large sound systems, PA systems, and concert venues.

Differential Amplifiers: Used in communication systems, audio equipment, and measurement instruments to amplify the difference between two input signals.

These are just a few examples, and there are many other types of amplifiers catering to specific applications and requirements.

Now that we are done with the theory let’s start building this project Step by Step

Create Speaker Enclosure

The first step in building your wireless Bluetooth speaker is to create the speaker enclosure. You can use any material you like, but we used acrylic.

To make this first, you need to use solidworks and create the design for the speaker. Then the next step is to cut them through a laser cutting machine (if you own one or through nearby shop)

bluetooth speaker enclosure

After laser cutting the parts will look like this.

bluetooth speaker laser cutting parts

Assembling Front Plate

Next thing you need to do is attach the speakers to the front plate of the laser-cut parts just attach some glue to the front plate and connect the 4 speakers to it.               

 

bluetooth speaker enclosure front plate

Back Cover

Take the back cover and attach the supporting side structures to it.

bluetooth speaker enclosure back plate

First attach the amplifier, Bluetooth module and the battery to the back plate.

When that is done. You can attach the TP0456 charging module and the switch.

Circuit Diagram of Wireless Bluetooth Speaker

Wireless Bluetooth Speaker using PAM8403 Amplifier Circuit Diagram

You can refer to the above circuit diagram to recreate your project. It’s simple to follow.

Final Assembly and Testing

When that is done, you can connect the front and back panel and then glue it.

Remove the paper layer of the acrylics to get an amazing final look.

Congratulations, you've just built your own wireless Bluetooth speaker! To use it, simply turn on your Bluetooth-enabled device and pair it with the speaker. You should now be able to enjoy high-quality sound from your new DIY speaker.

In conclusion, building a wireless Bluetooth speaker is a fun and rewarding project that anyone can do with some basic electronic components and a little bit of know-how. Just follow the steps outlined above, and you'll be on your way to enjoying your very own homemade speaker in no time!

Projects using Bluetooth and Speakers

Arduino Bluetooth Speaker with Reactive NeoPixel LEDs
Arduino Bluetooth Speaker with Reactive NeoPixel LEDs

Imagine immersing yourself in the rhythm of your favorite music while being surrounded by a dazzling display of colorful lights that dance in sync with every beat. In this blog, we will explore how to build an Arduino-powered Bluetooth speaker that not only delivers impressive sound but also features reactive NeoPixel LEDs that respond to the music. Get ready to bring your music listening experience to a whole new level of audiovisual delight!

Raspberry Pi Bluetooth Speaker: Play Audio wirelessly using Raspberry Pi
Raspberry Pi Bluetooth Speaker: Play Audio wirelessly using Raspberry Pi

Tired of being tied down by cables while listening to your favorite music? In this blog, we'll explore how to transform your Raspberry Pi into a Bluetooth speaker, allowing you to wirelessly stream audio from your smartphone, tablet, or any Bluetooth-enabled device. Say goodbye to tangled wires and embrace the convenience and freedom of a Raspberry Pi Bluetooth speaker setup!

Simple Microphone to Speaker Amplifier Circuit
Simple Microphone to Speaker Amplifier Circuit

Are you looking to amplify the sound from a microphone and directly drive a speaker? In this blog, we'll guide you through the process of building a straightforward microphone-to-speaker amplifier circuit. With just a few components and minimal soldering skills, you can create an amplifier that will enhance the audio captured by a microphone and produce louder output through a speaker. Let's dive in and get started!

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Efficient and Reliable Solutions to Meet New Emission Standards in Two-Wheelers

Submitted by Allegro MicroSystems on

The increase in requirements for highly fuel-efficient, lower-emission two-wheelers is driving internal combustion engine designers to switch from carburetor-based air-fuel mixing to electronic fuel injection (EFI) systems. Designers are now challenged to find cost-effective solutions that solve the challenges of fast startup and enable reliable operation of EFI systems. This article discusses the challenges that two-wheeler designers face when switching to an EFI system, notably a 100 ms fast startup requirement. A reliable, efficient, cost-effective solution that enables quick flow of fuel to achieve the desired startup is presented. By enabling simplified designs that achieve fast startup, simplify bills of materials (BOMs), and facilitate electromagnetic-compatibility (EMC) compliance, the solution presented can improve reliability and shorten research and development time in two-wheelers.

Basics of Fuel-Mixing Systems

In an internal combustion engine, proper mixing of fuel and air in specified proportion is critical for efficiency and reliability. Low-cost two-wheelers have commonly used carburetor-based fuel mixing, but—to meet new carbon emission standards—they are being phased out in favor of the efficiency offered by EFI methods.

Carburetor systems mix air and fuel for combustion using mechanical parts, such as the fuel float chamber and the throttle venturi as well as fuel jets that spray fuel and mix it with incoming air. When the throttle of the vehicle is opened, air flow through the carburetor increases, and the venturi effect causes fuel to enter the chamber. As air flow increases, air suction increases, as does delivery of fuel, resulting in increased vehicle acceleration.

An EFI system integrates a high-speed brushless DC (BLDC) motor controlling a fuel injector that delivers fuel to the engine. An EFI system consists of electronic sensors and a fuel pump that delivers fuel to the combustion chamber located inside the fuel tank of the vehicle. The fuel supply to the combustion chamber is governed by an electronic control unit (ECU) that constantly monitors the fuel supply and precisely controls the ratio of the fuel flow based on the engine requirement. The ECU uses various parameters—throttle position, engine speed, engine temperature, and engine load, among others—for the precise and efficient control of fuel injection directly into the combustion chamber of the cylinder. A basic block diagram of an EFI system is shown in Figure 1.

Block diagram of an EFI system
Figure 1: Block diagram of an EFI system.

The fuel pump in an EFI system draws fuel out of the fuel tank and provides it to the fuel injectors via multiple stages, as shown in Figure 1. This pump is generally driven by a BLDC motor because of its reliability, high power density, high efficiency, lower noise, lower electromagnetic interference (EMI), lower maintenance requirement, and longer life span. Unlike the traditional brushed DC motors that use brushes to transfer electrical current to the rotor, BLDC motors have permanent magnets on the rotor and electromagnets on the stator, allowing for a more efficient transfer of energy. Commutation of a BLDC motor is achieved electronically based on the instantaneous rotor position. Some systems use rotor alignment, but sensorless control of the BLDC motor system is preferred for greatest reliability.

Comparing Carburetor-Based and EFI Solutions

The traditional mechanical design of carburetor systems is very rugged. However, the air-fuel mixture cannot be accurately controlled, which leads to less fuel efficiency and increased emissions. Performance is also affected by ambient conditions, such as temperature. Maintenance (cleaning, adjustment, and tuning) is frequently required in a carburetor-based system, albeit this maintenance can be performed quickly and at low cost.

EFI systems are more accurate in the air-fuel-mixture ratio for a given driving condition and provide cleaner and more-efficient combustion. Also, throttle responses are quicker, and fuel economy is much better. Moreover, EFI systems are less prone to damage and therefore are generally maintenance free. However, EFI systems are typically perceived to be expensive compared to conventional carburetors, and tuning of fuel injection systems through ECU mapping is complex, which increases the cost when maintenance is needed.

Carburetor-based and EFI solutions are compared in Table 1. As two-wheeler manufacturers make the switch to EFI systems to meet new emission standards, designers are now looking to balance the new associated tradeoffs.

Comparison of Carburetor-Based System and EFI System

Attributes

Carburetor-Based System

Electronic Fuel Injection System

Versatility

Air-Fuel Mixing

Crude

Precise

Combustion

Less Efficient

More Efficient

Emission

High

Low

Mileage

Fuel Efficiency

Low

High

Performance

Throttle Response

Slow (Lag)

Faster

External Factors

Highly Impacted

No Impact

Tuning

Process

Manually

Via ECU Mapping

Easiness

Easy and Quick

Complex and Sluggish

Maintenance

Dust Impact

High Probability

Less Probability

Requirement

Frequent

Rare

Complexity

Easy (Outside Engine)

Difficult

Cost

Low

High

Cost

Overall Cost

Less Expensive

More Expensive

Speed, Efficiency, Reliability, and Ease of Tuning

Quick fuel delivery in a kick-start system critically requires quick BLDC motor startup. The efficiency of the overall system is crucial in the design. Because the device temperature is directly proportional to the power loss, minimizing power losses in the motor driver IC is also crucial. These requirements present fuel pump challenges that require an understanding of fuel pump operation.

Fuel-pump startup time—from zero to full speed—typically must be as little as 100 ms. During this time, the BLDC motor must complete either a rotor alignment cycle or an initial position detection (IPD) sensorless starting cycle plus a transition to the sensorless mode. The required fast and reliable startup of a sensorless BLDC motor requires a driver that can perform the rapid IPD cycle within these requirements.

While there are many solutions available on the market today, the Allegro A89303 three-phase sensorless BLDC motor driver IC purpose-designed for fuel pump application is a fast, efficient, reliable option. An Allegro-proprietary sensorless startup algorithm is incorporated that uses a trapezoidal drive algorithm to minimize time to ramp-up to maximum speed. It ensures fuel-pump startup to full speed in typically 50 ms, as shown in Figure 2. A two-pulse IPD algorithm ensures reliable and accurate initial position detection—with low resolution (30 degrees) in fast detection time (see the A89303 product datasheet)—and assists in reducing the overall startup time of the BLDC motor. An overlapping mode adaptively adjusts (leads) the phase angle of the applied voltage. This phase leading allows efficient operation of the BLDC motor and maximizes the extraction of power from the BLDC motor. These features enable easier startup and smooth, responsive, efficient operation of kick-starters.

Starting of a fuel pump BLDC motor with A89303
Figure 2: Starting of a fuel pump BLDC motor with A89303.

To meet the goals of the industry, the device needs to allow for easy tuning and protection against various fault scenarios. Many applications also require detailed diagnostics of faults. In addition to in-housing many advanced features that improve overall motor-drive efficacy—including a low on-state resistance (RDS(on)) MOSFET power stage, integrated charge pump, and I2C communication block set—the highly integrated A89303 motor driver provides fault reporting against various unwanted scenarios—such as overcurrent (motor phase short), overvoltage, undervoltage, charge-pump undervoltage, lock detection, and thermal shutdown. To allow the tuning of various electrical parameters, the I2C registers enable detailed diagnostics to be read and the I2C interface allows for ease of programming. In total, the A89303 delivers the speed, efficiency, reliability, and ease of tuning demanded by the two-wheeler industry.

Reliability with EMC Compatibility and Design Simplification

Although many motor driver ICs may be available to satisfy speed, efficiency, and tuning challenges, they typically come with significant additional development time and cost for EMC compliance, as well as complexity that reduces reliability.

Integrated devices are subject to EMI. Driver designs that place capacitor(s) and regulator(s) outside of the IC create a high-frequency emission source that results in EMI. To mitigate this noise, additional components, such as beads, are often required for EMC compliance. This is especially true in high-frequency-switching applications, such as motor drivers for fuel pumps. The additional components lead to larger, complex designs with increased development time and increased points of potential failure.

Considering the EMI challenges that arise with EFI systems, a fast, reliable, cost-effective solution likely means one that minimizes sources of high-frequency noise and facilitates EMC compliance such that development schedules are reduced, BOMs are reduced, and commensurate savings are gained.

The Allegro A89303 addresses this need by in-housing the capacitor of the internal regulator, which bypasses the high-frequency switching noise of the internal digital circuitry. A spread spectrum clock in the device also minimizes EMI by spreading the emission. By bypassing and spreading the high-frequency-switching noise, systems that integrate the A89303 can earn extra margin to facilitate EMC compliance and accelerate development schedules.

BLDC motor driver operation using the A89303 requires only six passive components, as shown in Figure 3. By minimizing the number of additional components using a compact device size—the A89303 is available in the small 6.5 mm x 4.4 mm thin-shrink small-outline package (TSSOP) and the smaller 5 mm x 5 mm quad-flat no-leads (QFN) package—a smaller PCB can be used to realize a smaller, more-efficient, cost-effective solution.

Low component count for the A89303 device
Figure 3: Low component count for the A89303 device.

The High-Performance, Cost-Balancing Solution

To meet changing emission standards, many two-wheeler system designers now face the need to switch from carburetor-based systems to EFI systems. Many purpose-designed features make the Allegro A89303 motor driver IC an ideal solution for fuel pump applications, including fast and accurate startup, efficient optimization, integrated protection features, fault handling, and ease of programmability.

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In India's Automotive Industry, Connected Vehicle Penetration to Surpass 26% by the End of 2023

EVs are expensive compared to ICE vehicles because of the battery cost. The EV battery cost makes up 60% of the total EV price. Therefore, to compensate for the high price of EVs, the automakers add features and functionalities to present them as differentiating factors to the buyers. These features generally aim to provide safety and convenience to the driver.

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