Nexperia
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Nexperia’s High-Density CCPAK1212 MOSFETs: With Top-Side and Bottom-Side Cooling Options for Power-Intensive Applications
Nexperia has launched 16 new power MOSFETs in the copper-clip CCPAK1212 package, which includes both 80 V and 100 V… |
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Nexperia Releases New 80 V and 100 V LFPAK MOSFETs with Lower On-Resistance
Nexperia has expanded its NextPower 80 V and 100 V MOSFET lineup by introducing new LFPAK devices in 5x6 mm and 8x8 mm… |
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Nexperia Expands SiC MOSFET Portfolio with D2PAK-7 Packaging
Nexperia has introduced its latest innovation in power electronics, announcing the availability of 1200 V silicon… |
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New Planar Schottky Diodes in Space-Saving CFP3-HP Packaging Optimized for Automotive Applications
Nexperia has announced a new portfolio of 22 new planar Schottky diodes in CFP3-HP packaging. This … |
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New LCD Bias Power ICs Extend Battery Life and Video Display Lifetime in Smartphones and VR Headsets
Nexperia has introduced a new series of space-saving, high-efficiency, dual-output LCD bias power supplies… |
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New Wafer-Level 12V & 30V MOSFETs Save Power and Simplify Thermal Management in Space-Constrained Applications
Nexperia has introduced the new PMCB60XN and PMCB60XNE 30V N-channel small-signal trench MOSFETs, with market… |
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New Rugged and Reliable Devices in Miniature DFN Packaging with Side-Wettable Flanks
Nexperia has announced its latest product additions to a growing range of discrete devices which are available in… |
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Advanced Electrothermal MOSFET Models enable Investigation of EMC Performance even Before Prototyping
Nexperia has announced the release of enhanced Electrothermal models that capture the thermal interdependency of the complete… |
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AEC-Q101 Qualified ESD Protection Solutions for Automotive Ethernet
Nexperia has announced an expansion to its portfolio of automotive ethernet ESD protection devices with three new… |
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SD Card Level Translator with Integrated Auto-Direction Control and EMI Filter
Nexperia has introduced a small Secure Digital (SD) card level translator IC “NXS0506UP” that is housed in a 16-bump wafer… |
