New Product
|
X-Class CMOS Image Sensor Platform from ON Semiconductor Enables New Functionality for Industrial Camera Design
X-class image sensor platform permits the camera design to enable not only multiple product resolutions but also the different… |
|
New 1-MHz active clamp flyback chipset and industry-first 6-A three-level buck battery charger cut power supply size and charge time in half
Texas Instruments introduces new power management chips that allow the engineers to boost efficiency and shrink the power… |
|
Toshiba Develops Ultra-low-power Analog AI Accelerator Chip for Embedded Systems
Analog AI Accelerator Chip will accelerate the origination of AI technologies into embedded devices which have been difficult… |
|
Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs
TI's new operational amplifier and comparators reduce overall system footprint in IoT, personal electronics, and industrial… |
|
STMicroelectronics and USound Deliver First Advanced MEMS Silicon Micro-Speakers
After the announcement of Technology collaboration of both the Multinational Companies, STMicroelectronics and USound presents… |
|
Samsung Optimizes Premium Exynos 9 Series 9810 for AI Applications and Richer Multimedia Content
Samsung’s new Exynos 9 series 9810 increases smartphones user experience with its premium features of 2.9GHz custom CPU, an… |
|
Complete Full-Bridge System-in-Package Includes MOSFETs, Gate Drivers, and Protection to Save Space, Simplify Design and Streamline Assembly
STMicroelectronics developed a new module PWD13F60 which saves the material cost, lesser dimension (13*11mm) and contains a… |
